ON Semiconductor adds SiP module to Bluetooth 5 radio family
Extending the RSL10 family of Bluetooth 5 certified radio system on chips (SoCs), ON Semiconductor has developed a ready-to-use 6.0 x 8 x 1.46mm system in package (SiP) module. The RSL10 devices support Bluetooth low energy wireless profiles and can be designed into any connected application including sports/fitness or mHealth wearables, smart locks and appliances.
The RSL10 SiP has an integrated antenna, RSL10 radio, and all the required passive components. It is certified by the Bluetooth Special Interest Group (SIG), and reduces time-to-market and development costs by removing the need for any additional RF design considerations, advises ON Semiconductor.
The RSL10 consumes just 62.5nW while in deep sleep mode, and seven mW peak receive power. Its energy efficiency was recently validated by the EEMBC’s ULPMark where it became the first device in the benchmark’s history to break 1,000 ULP Marks and produced Core Profile scores more than twice as high as the previous industry leader, reports ON Semiconductor.
The RSL10 SIP is offered in a 51-pin 6.0 x 8.0 x 1.46mm package. Samples or an evaluation board are available now via ON Semiconductor sales representative or authorised distributors.
