NXP’s new i.MX 93W fuses edge compute and secure wireless connectivity
NXP Semiconductors has announced the i.MX 93W applications processor, expanding NXP’s i.MX 93 family. Purpose-built to accelerate physical AI deployment, the i.MX 93W SoC is the industry’s first applications processor to combine a dedicated AI neural processing unit (NPU) with secure tri-radio wireless connectivity. This high degree of integration allows customers to replace up to 60 discrete components with a single package. Pre-certified reference designs eliminate many common integration challenges, reducing the complexity, cost and risk traditionally associated with RF design. Supported by NXP’s software and industry-leading eIQ AI enablement solutions, the i.MX 93W also supports smaller form factors and is designed to accelerate time-to-market for physical AI applications.
Physical AI requires coordinated AI agents to collaborate locally, taking real-time action with low latency and high reliability. For example, AI agents might coordinate across a smart building’s lighting, HVAC, access control, occupancy and smart energy systems to autonomously optimise comfort, energy efficiency, and operational responsiveness securely in real time.
NXP’s new i.MX 93W addresses this need by integrating scalable edge compute, AI acceleration, and secure wireless connectivity in a single package, supported by NXP’s software, eIQ AI enablement and pre-certified reference designs. This allows coordinated AI agents to locally manage physical environments, such as a group of healthcare agents working together to coordinate wearables, smart diagnostics, sensors and health gateways that deliver real-time healthcare insights and actions. The highly integrated i.MX 93W SoC also allows customers to rapidly scale physical AI across healthcare devices, smart building controllers, industrial gateways, energy infrastructure monitors and smart home hubs.
The i.MX 93W applications processor combines a dedicated AI NPU with secure tri-radio wireless connectivity in a single package. This eliminates the need for up to 60 discrete components, significantly reducing board area, design and supply chain complexity and system-level costs. The i.MX 93W features a dual-core Arm CortexA55 applications processor with a dedicated Arm Ethos NPU capable of up to 1.8 eTOPs. The integrated IW610 tri-radio combines Wi-Fi 6, Bluetooth Low Energy, and 802.15.4 connectivity supporting Matter and Thread deployments. This eliminates complex RF tuning steps and coexistence challenges that traditionally slow development and certification, speeding time-to-market.
The i.MX 93W SoC integrates an EdgeLock Secure Enclave (Advanced Profile), addressing regulatory requirements, including European Cyber Resilience Act (CRA). The embedded EdgeLock Secure Enclave is a hardware root of trust simplifying implementation of security-critical functions like secure boot, secure update, device attestation and secure device access. Combined with NXP’s EdgeLock 2GO key management services, OEMs can securely provision i.MX 93W SoC-based products at device manufacturing or in the field.
NXP’s pre-certified i.MX 93W SoC-based single and dual-antenna reference designs minimise RF tuning effort and eliminating many common integration challenges. Certified across multiple countries and regions, these reference designs reduce the complexity, cost and risk traditionally associated with RF design and wireless certification. By leveraging validated antenna options and pre-approved designs, customers can shorten regulatory approval timelines, reduce development cost, and bring products to market faster.
