Module is claimed to be world’s smallest Bluetooth Smart
Designed for the Bluetooth 4.0 low energy (LE) specification, or Bluetooth Smart, the SESUB-PAN-T2541 Bluetooth 4.0 LE module is claimed to be the world’s smallest module. The footprint is 4.6×5.6x1mm.
It can be used for wearable devices says TDK, a market that market researchers expect will grow rapidly in the near future.
The module is based on the company’s proprietary SESUB (semiconductor embedded in substrate) technology. The Bluetooth IC die is embedded into the thin substrate, and all the peripheral circuitry, including a quartz resonator, bandpass filter and capacitors are integrated on top. It is, says the company, nearly 65% smaller than modules that employ discrete components. Its substrate layers optimally route all of the I/Os to a BGA on the module’s bottom surface. It facilitates hardware design, says the company, and allows easy implementation of Bluetooth connectivity simply by connecting it to a power supply and antenna.
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