DSP-based system accelerates ‘smart’ device development
Claimed to accelerate the deployment of ‘smart and connected’ devices, the CEVA-TeakLite-4-based development platform encompasses processing, connectivity, sensing and application software. These are used as building blocks for prototyping IoT devices, Richard Kingston, VP marketing, CEVA explained at the Pinnacle European Press Summit in Munich, Germany.
Target markets are mobile, wearables and the smart home, he added. The platform is built around the company’s CEVA-TeakLite-4 DSP and sub-system implemented in SMIC’s 55nmLP process. Running at 500MHz, and with multiple peripherals (TDM, DMA, I²C, I²S, ICU, timers, GPIO) and system interfaces, the DSP allows designers to add ‘smart and connected’ capabilities to devices, including always-on sensing (contextual awareness both audio and motion), local, as opposed to cloud intelligence processing and connectivity using multiple standards, such as Bluetooth, Wi-Fi, ZigBee and GNSS. The platform also provides real-time power measurement that allows developers to optimise and power-tune their DSP software, says the company.
The host CPU has Linux running on-board an ARM Cortex-A9 for CPU and DSP system prototyping. Arduino connectors and drivers mean that Arduino Shields can be connected to the board, to leverage the Arduino-related ecosystem.
The company’s Android Multimedia Framework (AMF) offloads Android tasks from CPU to DSP to enhance always-on functionality and long audio playback time. Multi-tasking RTOS and a DSP library are also provided to speed system design.
The company’s ecosystem of partners offers audio, voice and sensing software and applications optimised for the CEVA-TeakLite-4 DSP from partners including NXP Software (multi-microphone noise reduction), Sensory (always-on voice activation and speech recognition), Cypher’s neural-network based voice isolation technology, sensor-fusion algorithms from Cywee Motion and over 100 other software functions.
http://www.ceva-dsp.com
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