NXP Semiconductors has announced the i.MX 93W applications processor, expanding NXP’s i.MX 93 family. Purpose-built to accelerate physical AI deployment, the i.MX 93W SoC is the industry’s first applications processor to combine a dedicated AI neural processing unit (NPU) with secure tri-radio wireless connectivity. This high degree of integration allows customers to replace up to 60 discrete components with a single package. Pre-certified reference designs eliminate many common integration challenges, reducing the complexity, cost and risk traditionally associated with RF design. Supported by NXP’s software and industry-leading eIQ AI enablement solutions, the i.MX 93W also supports smaller form factors and is designed to accelerate time-to-market for physical AI applications.
Wearable
ST’s sensor and secure wireless technologies support Snapdragon Wear Elite
ST now supports leading-edge motion-sensing and secure wireless technologies on Qualcomm Technologies’ newly launched personal AI platform, Snapdragon Wear Elite. ST components help unlock always on sensing, unprecedented power efficiency, and breakthrough user experiences for the next generation of truly personal, responsive wearable computing devices, enabling advanced use cases like activity recognition and health and lifestyle monitoring.
ST launches tiny motion sensor for wearable and implantable medical applications
STMicroelectronics’ MIS2DU12 MEMS accelerometer combines ultra-low power, signal processing, and an ultra-low profile suitable for wearable and implantable medical applications.
Produced using biocompatible materials and manufacturing processes, the MIS2DU12 has a 20nA power-down and sub-1µA active mode to extend the operating envelope of implantables such as cardiac monitors and pacemakers. At only 0.74mm high, and 2mm x 2mm, it enables skin patches to become extremely slim, lightweight, and comfortable to wear.
In skin patches such as glucose monitors and other bio-parameter sensors, the MIS2DU12’s sensor fusion ensures precision even during macroscopic motion and environmental stress. The applications benefit from high micro-motion sensitivity, power efficiency. The dedicated internal engine for motion processing detects free-fall, wake-up, single/double-tap, activity/inactivity, and calculates 6D/4D orientation. There are also built-in self-test and an embedded temperature sensor.
With integrated motion processing for event detection and wake-up, the MIS2DU12 contains an anti-alias filter to maximize output-data quality. By removing out-of-band vibration sources, this filter offloads the main application processor to help cut system power consumption. The sensor draws just 0.47μA in ultra-low-power active mode with 1.6Hz output data rate, and 5.6µA in normal operation with the anti-alias filter enabled.
The MIS2DU12 has user-selectable full scales of ±2g/±4g/±8g/±16g, output data rates from 1.6Hz to 800Hz, and operates over the extended temperature range from -40°C to +85°C. An integrated 128-level FIFO buffer provides generous data storage and extra flexibility to save system power consumption.
For rapid evaluation, the STEVAL-MKI255A adapter board contains a MIS2DU12 sensor and has a standard DIL24 pin arrangement for use with the STEVAL-MKI109D evaluation board. The board includes a high-performance 32-bit microcontroller and is ready to use with ST’s MEMS Studio GUI.
Bosch Sensortec launches IMU precision sensing for the always-on era
At CES 2026, Bosch Sensortec introduced the BMI423, a new-generation Inertial Measurement Unit (IMU) that combines extended measurement range with low power consumption. Designed for always-on applications such as wearables, hearables and robotics, the BMI423 delivers precise motion data and intelligent on-sensor functionality while maximising battery life.
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