Digiseq has received Mastercard certification for a world-first pre-certified concentric ring inlay, opening up the market for small independents and large brands to quickly and effectively launch payment rings within their collections. The inclusion of the ring inlay with integrated secured NFC chip can deliver multiple services, opening new use cases in addition to payments, such as loyalty, access, events and hospitality for consumers’ everyday life.
ICs & Semiconductors
ITEC claims latest RFID inlay die bonder is fastest and most accurate yet
According to ITEC, its ADAT3 XF Tagliner is the industry’s fastest and most accurate RFID inlay die bonder. It has placement speeds of up to 48,000 units per hour (UPH), with positional and rotational accuracies better than nine microns and 0.67 degrees at one sigma. It is three times faster and 30 per cent more accurate than other die bonding equipment, claimed the company. “
PSoC 4000T has 10x higher SNR for multi-sense applications
The PSoC 4000T family of microcontrollers is claimed to delivers best-in-class low-power capacitive sensing with signal-to-noise ratio (SNR), liquid tolerance and multi-sense capabilities coupled with highest reliability and robustness.
Two data lane ReDriver supports MIPI D-PHY 1.2 protocols
A low power, high performance MIPI D-PHY 1.2-compliant signal ReDriver by Diodes, the PI2MEQX2503, regenerates signals transmitted at data rates up to 2.5Gbits per second from cameras to displays. It is suitable for various applications, including laptops, tablets, mobile phones, IoT devices, commercial displays, augmented reality headsets, drones and robots.
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