Robust package technology, MRigidCSP, by Alpha and Omega Semiconductor (AOS), is initially offered on its AOCR33105E, 12V, common drain, dual N-channel MOSFET. The packaging technology is designed to decrease on resistance while increasing mechanical strength, and is particularly suited to battery applications in smartphones, tablets and ultra-thin notebooks.
AOS explained that fast charging, which requires lower power loss in the battery management circuit, is now widely adopted for portable devices. As the charging currents increase, ultra-low electrical resistance is needed for improved performance. In standard wafer-level chip scale packages (WL-CSPs), the substrate can be a significant portion of the total resistance when back-to-back MOSFETs are employed in battery management applications. A thinner substrate reduces the overall resistance but drastically reduces the package’s mechanical strength. This reduction of mechanical strength can lead to more stress during the PCB assembly reflow process, potentially causing warping or cracking in the die and, ultimately, failure in the application. The AOCR33105E is designed with trench-power MOSFET technology in a common drain configuration for design simplicity. It features low on resistance with ESD protection to improve performance and safety in battery management, such as protection switches and mobile battery charging and discharging circuits.
“Incorporating the AOS MRigidCSP packaging technology with our new dual N-channel MOSFET combines electrical performance improvements with the benefit of high robustness,” said Peter H. Wilson, senior MOSFET product line marketing director at AOS.
AOS designed the MRigidCSP package technology to be used with high aspect ratio CSP die sizes. The CSP construction delivers “a significantly strengthened battery MOSFET that won’t warp or break during the board manufacturing process,” added Wilson.
The AOCR33105E is available in a 2.08 x 1.45mm package, with RDS(on) of 3mOhm at 4.5V / 4.2mOhm at 3.1V.
The AOCR33105E in the MRigidCSP package is immediately available in production quantities with a lead time of 14 to 16 weeks. It is RoHS 2.0 compliant and is halogen-free.
ICs & Semiconductors
Medical sensor measures ECG wirelessly
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Proximity sensing Hall switches save board space
Two monolithic, unipolar Hall-effect switched have been designed by Diodes for proximity sensing in battery-powered applications. They have a low 1.1 microA supply current at 1.85V, and 1.6 microA at 1.6V to 5.5V, which make them suitable for battery-powered portable equipment like smartphones, laptops and wearables. They can also be used for domestic appliances, game consoles and industrial hardware use.
The 1.6V to 5.5V operating voltage enables the switches to be powered directly from a portable device’s battery, eliminating the area and cost of power conversion. Output 1 in the dual-output AH139x series responds to a North pole, while Output 2 responds to a South pole with typical operating points of 25G (AH1391) and 30G (AH1392). The single output on the AH138x series responds to a South pole on the part-marking side with typical operating points of 18G (AH1381), 30G (AH1382), and 45G (AH1383).
The tight operating window ensures a lower magnetic spread, said Diodes, while the chopper-stabilised design provides minimal switch point drift and “superior temperature stability”. The switches also have a strong human body model (HBM) electrostatic discharge (ESD) protection. Metrics are 8kV for the AH138x and 6kV for the AH139x series. These devices also have push-pull outputs that do not require an external pull-up resistor, simplifying system design, saving board space, and lowering the bill of materials.
All models are provided in DFN1010-4 and DFN1410-4, which are claimed to be the industry’s smallest packages. The AH1381, AH1382, and AH1383 versions are additionally available in SOT23 packaging.
Diodes delivers semiconductor products to companies in the automotive, industrial, computing, consumer electronics and communications markets. Its product portfolio includes discrete, analogue and mixed-signal products and packaging technology.
The company has worldwide operations of 32 sites, including engineering, testing, manufacturing, and customer service.
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