u-blox has announced the expansion of its short-range radio portfolio with new low-latency Edge Machine Learning (Edge ML) capabilities. The launch strengthens the collaboration between u-blox and Nordic Semiconductor with the introduction of the ALMA-B2 Bluetooth LE module series. Based on Nordic’s next-generation nRF54LM20 platform, ALMA-B2 combines next-generation Bluetooth LE connectivity with a powerful wireless MCU, delivering Channel Sounding, global certification, and flexible antenna options in a compact form factor, enabling a new class of intelligent, low-power IoT applications.
Weartech-Comms / Bluetooth / Wireless
Emendion selects Insight SIP’s for their Bluetooth Low Energy and Auracast miniature microphone
Bluetooth Low Energy (LE) Audio has been available for several years now, based on the Bluetooth 5.2 release, with the full specifications completed in 2022. It takes time, however, for specifications to yield working devices, and in the case of LE Audio, to have true value, you need an ecosystem of compatible “other ends” – headphones, speakers, smartphone support and so on. This takes time, and so it is only now that use of LE Audio is becoming prevalent in audio solutions.
Wireless modules for embedded systems now available from Tria Technologies
Tria Technologies, an Avnet company has announced the availability of two new wireless modules, the SPB611 and SPB209. These modules support multiple short-range protocols and help speed the development of wireless-enabled embedded systems.
NXP’s new i.MX 93W fuses edge compute and secure wireless connectivity
NXP Semiconductors has announced the i.MX 93W applications processor, expanding NXP’s i.MX 93 family. Purpose-built to accelerate physical AI deployment, the i.MX 93W SoC is the industry’s first applications processor to combine a dedicated AI neural processing unit (NPU) with secure tri-radio wireless connectivity. This high degree of integration allows customers to replace up to 60 discrete components with a single package. Pre-certified reference designs eliminate many common integration challenges, reducing the complexity, cost and risk traditionally associated with RF design. Supported by NXP’s software and industry-leading eIQ AI enablement solutions, the i.MX 93W also supports smaller form factors and is designed to accelerate time-to-market for physical AI applications.
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