u-blox has announced the availability of the first products based on its F11 platform. Headlined by the UBX-F11270-KB and UBX-F11170-CC GNSS chips, and the EVK-F112 evaluation kit, the launch establishes the foundation for a new generation of ultra-low power positioning solutions that will expand across multiple product categories.
Wearable
ST unveils first secure mobile chip with post-quantum cryptography for connected services
ST has introduced the ST54M, a secure mobile chip designed to help smartphone and personal electronics manufacturers meet upcoming quantum-ready security requirements while supporting a seamless user experience across connected services.
Bosch Sensortec and Espressif develop magnetic sensing platform for wearables and smart devices
Bosch Sensortec and Espressif Systems have collaborated on a new magnetic sensing interaction solution designed for wearables, AI toys and other compact smart devices. The platform combines Bosch Sensortec’s 3-axis magnetic sensors with Espressif SoCs to enable non-contact accessory detection, position sensing and gesture-based interaction.
ST unveils new compact direct Time-of-Flight 3D LiDAR module
ST has announced the launch of the VL53L9, a compact direct Time-of-Flight 3D LiDAR all-in-one module that sets a new benchmark in high-resolution sensing. The VL53L9 combines state-of-the-art features in a compact and cost-effective package, delivering AI-ready output data for low-compute edge AI systems on small microcontrollers (MCUs) and high-performance sensing across a wide range of applications across robotics, industrial automation, smart buildings, AR/VR, and healthcare.
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