A development starter kit for fast haptics prototyping gives mechanical designers and engineers a first impression of haptic feedback with PowerHap piezo actuators. The kit by TDK shows how the mechanical integration works, and provides a reference design, which can be adapted to various applications.
TDK’s PowerHap piezo actuators offer haptic feedback based on acceleration, force, and response time. They can be used in automotive designs (e.g., steering wheels, displays, dashboards, buttons), smartphones, displays and tablets, household appliances, ATMs and vending machines, game controllers, VR gloves, industrial equipment and medical devices.
The PowerHap Starter Kit (ordering code: Z63000Z2910Z01Z73) consists of a seamless button assembly (including PowerHap 1204H018V060 and PowerHap 1313H018V120), a round button assembly (incling PowerHap 1204H018V060), the BOS1901-Kit driver board from Boréas Technologies, additional PowerHap devices (including an FPC connection cable), USB cable, and a quick start user guide.
The BOS1901-Kit platform in the starter kit is pre-programmed for the seamless button and the round button for an immediate experience of sensing and haptics with the PowerHap actuators. The features of the Boréas platform make it easy to customise and tailor the haptic experience by adjusting the sensing detection parameters and the haptic feedback waveform.
TDK is based in Tokyo, Japan. It was established in 1935 to commercialise ferrite, a key material in electronic and magnetic products. Today, TDK‘s portfolio features passive components such as ceramic, aluminium electrolytic and film capacitors, as well as magnetics, high-frequency, and piezo and protection devices. The product spectrum also includes sensors and sensor systems such as temperature and pressure, magnetic, and MEMS sensors. In addition, TDK provides power supplies, energy devices and magnetic heads. Products are marketed under the product brands TDK, Epcos, InvenSense, Micronas, Tronics and TDK-Lambda.
TDK focuses on demanding markets in automotive, industrial and consumer electronics, and information and communication technology. The company has a network of design and manufacturing locations and sales offices in Asia, Europe, and in North and South America.
IoT
MRigidCSP package is claimed to increase MOSFET’s mechanical strength
Robust package technology, MRigidCSP, by Alpha and Omega Semiconductor (AOS), is initially offered on its AOCR33105E, 12V, common drain, dual N-channel MOSFET. The packaging technology is designed to decrease on resistance while increasing mechanical strength, and is particularly suited to battery applications in smartphones, tablets and ultra-thin notebooks.
AOS explained that fast charging, which requires lower power loss in the battery management circuit, is now widely adopted for portable devices. As the charging currents increase, ultra-low electrical resistance is needed for improved performance. In standard wafer-level chip scale packages (WL-CSPs), the substrate can be a significant portion of the total resistance when back-to-back MOSFETs are employed in battery management applications. A thinner substrate reduces the overall resistance but drastically reduces the package’s mechanical strength. This reduction of mechanical strength can lead to more stress during the PCB assembly reflow process, potentially causing warping or cracking in the die and, ultimately, failure in the application. The AOCR33105E is designed with trench-power MOSFET technology in a common drain configuration for design simplicity. It features low on resistance with ESD protection to improve performance and safety in battery management, such as protection switches and mobile battery charging and discharging circuits.
“Incorporating the AOS MRigidCSP packaging technology with our new dual N-channel MOSFET combines electrical performance improvements with the benefit of high robustness,” said Peter H. Wilson, senior MOSFET product line marketing director at AOS.
AOS designed the MRigidCSP package technology to be used with high aspect ratio CSP die sizes. The CSP construction delivers “a significantly strengthened battery MOSFET that won’t warp or break during the board manufacturing process,” added Wilson.
The AOCR33105E is available in a 2.08 x 1.45mm package, with RDS(on) of 3mOhm at 4.5V / 4.2mOhm at 3.1V.
The AOCR33105E in the MRigidCSP package is immediately available in production quantities with a lead time of 14 to 16 weeks. It is RoHS 2.0 compliant and is halogen-free.
Proximity sensing Hall switches save board space
Two monolithic, unipolar Hall-effect switched have been designed by Diodes for proximity sensing in battery-powered applications. They have a low 1.1 microA supply current at 1.85V, and 1.6 microA at 1.6V to 5.5V, which make them suitable for battery-powered portable equipment like smartphones, laptops and wearables. They can also be used for domestic appliances, game consoles and industrial hardware use.
The 1.6V to 5.5V operating voltage enables the switches to be powered directly from a portable device’s battery, eliminating the area and cost of power conversion. Output 1 in the dual-output AH139x series responds to a North pole, while Output 2 responds to a South pole with typical operating points of 25G (AH1391) and 30G (AH1392). The single output on the AH138x series responds to a South pole on the part-marking side with typical operating points of 18G (AH1381), 30G (AH1382), and 45G (AH1383).
The tight operating window ensures a lower magnetic spread, said Diodes, while the chopper-stabilised design provides minimal switch point drift and “superior temperature stability”. The switches also have a strong human body model (HBM) electrostatic discharge (ESD) protection. Metrics are 8kV for the AH138x and 6kV for the AH139x series. These devices also have push-pull outputs that do not require an external pull-up resistor, simplifying system design, saving board space, and lowering the bill of materials.
All models are provided in DFN1010-4 and DFN1410-4, which are claimed to be the industry’s smallest packages. The AH1381, AH1382, and AH1383 versions are additionally available in SOT23 packaging.
Diodes delivers semiconductor products to companies in the automotive, industrial, computing, consumer electronics and communications markets. Its product portfolio includes discrete, analogue and mixed-signal products and packaging technology.
The company has worldwide operations of 32 sites, including engineering, testing, manufacturing, and customer service.
Headset increases productivity with hands-free operation
The next generation of RealWear’s hands-free, wearable computers for frontline workers is the Navigator Z1 Intrinsically Safe (IS) headset, which accesses AI and 5G connectivity.
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