Farnell’s Top Tech Voices podcast continues its season with two new episodes featuring neuroscientist and founder Dr Anne-Laure Le Cunff and architect and MIT Professor Carlo Ratti.
Industry News Highlights
Infineon launches EU flagship project Moore4Power to drive the next generation of sustainable power electronics
Today marks the official launch of Moore4Power (More than Moore for Disruptive Innovations in Power Electronics), one of Europe’s most ambitious semiconductor R&D projects. Led by Infineon Technologies, this Chips Joint Undertaking initiative unites large entities, small and medium-sized enterprises and research institutes from 15 European countries to develop the next generation of smart, efficient and sustainable power electronics. With a total project volume of €91 million, Moore4Power will run for three years aiming to deliver breakthrough innovations that strengthen Europe’s technological sovereignty and sustainability in the field of power electronics.
ams OSRAM sells CMOS Image Sensor business to indie Semiconductor, concentrating its growth investments into AI Photonics and AR smart glasses
“With the divestment of our CMOS Image Sensor (CIS) business to indie, we are further sharpening our profile as the leader in Digital Photonics. While CIS represents a strong technology platform, our strategic priority is to concentrate investments on those AI driven segments that offer the most promising growth prospects and where we clearly differentiate – including AI Photonics and AR smart glasses. At the same time, the expected cash proceeds provide an additional contribution to our accelerated balance sheet deleveraging. Our transformation into the Digital Photonics powerhouse is progressing,” said Aldo Kamper, CEO of ams OSRAM
OE-A publishes 10th edition of the Roadmap for Flexible and Printed Electronics
With the publication of the 10th edition of the “OE-A Roadmap for Flexible and Printed Electronics,” the OE-A, an international working group for printed electronics within the VDMA, once again presents the central guidance and reference document for the industry. The roadmap offers a comprehensive overview of the current state of the industry as well as the future prospects for flexible and printed electronics.
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