Infineon has introduced the AIROC UWB TSL100, the company’s first-generation ultra-wideband (UWB) product family for precise positioning and smart presence detection. As part of Infineon’s AIROC portfolio, the TSL100 features a new architecture aimed at reducing power consumption and enhancing security. The product family marks the start of a scalable UWB platform intended to support future standards such as IEEE 802.15.4ab and is compliant with industry consortium standards such as CCC, Aliro, and FiRa. The TSL100 combines ranging and sensing capabilities in a single device, enabling applications such as secured vehicle access, in-cabin presence detection, access control, contactless payment, ticketing, and indoor navigation, as well as industrial use cases including asset tracking and collision avoidance. With the introduction of the AIROC UWB TSL100, Infineon strengthens its position in secured connected systems and expands its AIROC wireless portfolio with a new family of UWB devices. These devices combine precise positioning and smart presence detection on a single chip, addressing growing demand across automotive, consumer, and industrial markets.
Latest News
ST unveils first secure mobile chip with post-quantum cryptography for connected services
ST has introduced the ST54M, a secure mobile chip designed to help smartphone and personal electronics manufacturers meet upcoming quantum-ready security requirements while supporting a seamless user experience across connected services.
Bosch Sensortec and Espressif develop magnetic sensing platform for wearables and smart devices
Bosch Sensortec and Espressif Systems have collaborated on a new magnetic sensing interaction solution designed for wearables, AI toys and other compact smart devices. The platform combines Bosch Sensortec’s 3-axis magnetic sensors with Espressif SoCs to enable non-contact accessory detection, position sensing and gesture-based interaction.
ST unveils new compact direct Time-of-Flight 3D LiDAR module
ST has announced the launch of the VL53L9, a compact direct Time-of-Flight 3D LiDAR all-in-one module that sets a new benchmark in high-resolution sensing. The VL53L9 combines state-of-the-art features in a compact and cost-effective package, delivering AI-ready output data for low-compute edge AI systems on small microcontrollers (MCUs) and high-performance sensing across a wide range of applications across robotics, industrial automation, smart buildings, AR/VR, and healthcare.
About Weartech
This news story is brought to you by weartechdesign.com, the specialist site dedicated to delivering information about what’s new in the wearable electronics industry, with daily news updates, new products and industry news. To stay up-to-date, register to receive our weekly newsletters and keep yourself informed on the latest technology news and new products from around the globe. Simply click this link to register here: weartechdesign.com
