Infineon has expanded its CoolGaN BDS 40 V G3 bidirectional switch (BDS) family with two new devices, the IGK048B041S and IGK120B041S. The new additions reduce PCB footprint by up to 82 percent and cut component count in half. For engineers designing within the strict spatial constraints of modern smartphones, notebooks, and wearables, this is a significant and quantifiable step forward. Targeting compact consumer devices, the new devices give power system designers greater flexibility to optimise efficiency and streamline designs without sacrificing performance.
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ROHM launches an ultra-compact wireless power chipset for wearables
ROHM has developed a wireless power supply IC chipset consisting of the receiver – ML7670 – and transmitter – ML7671 – compatible with Near Field Communication (NFC) technology for compact wearables such as smart rings and smart bands as well as peripheral devices like smart pens.
Murata launches ultra-low power sensors for wearable and IoT devices
Murata has commenced mass production of its MRMS166R and MRMS168R anisotropic magnetoresistance (AMR) sensors for healthcare, wearable, and IoT devices. The MRMS166R is the first AMR sensor to combine an average current consumption of 20 nA with operation from a 1.2 V supply, enabling extended battery life in coin cell-powered systems.
ST announces new sensors for personal electronics and smart devices
ST has introduced a new generation of ultralow-power global-shutter image sensors that deliver high-quality, always-on vision to compact devices operating on batteries or harvested energy. The VD55G4 (monochrome) and VD65G4 (RGB colour) sensors, part of the ST BrightSense portfolio, are now available to early adopters, enabling customers to start designing their next generation of smart, ultralow-power vision devices today.
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