u-blox has announced the launch of the u-blox F11 platform. The new L1/L5 dual-band standard-precision GNSS platform is designed to improve positioning accuracy while reducing power consumption to as low as 7 mW in typical configurations using Low Energy Accurate Positioning (LEAP) mode for tracking and wearable applications.
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Intel expands Edge AI portfolio with Core Series 2 Processor
Intel has launched the Intel Core processor Series 2 with P-cores, an industrial-ready platform engineered for mission-critical edge applications. Intel also announced its latest Edge AI suite for Health & Life Sciences, providing validated reference pipelines and benchmarking tools for AI-powered patient monitoring solutions.
TI expands MCU portfolio and software ecosystem to enable edge AI in every device
Texas Instruments has introduced two new microcontroller (MCU) families with edge artificial intelligence (AI) capabilities, supporting the company’s commitment to enabling edge AI across its entire embedded processing portfolio. The MSPM0G5187 and AM13Ex MCUs integrate TI’s TinyEngine neural processing unit (NPU), a dedicated hardware accelerator for MCUs that optimises deep learning inference operations to reduce latency and improve energy efficiency when processing at the edge.
NXP’s new i.MX 93W fuses edge compute and secure wireless connectivity
NXP Semiconductors has announced the i.MX 93W applications processor, expanding NXP’s i.MX 93 family. Purpose-built to accelerate physical AI deployment, the i.MX 93W SoC is the industry’s first applications processor to combine a dedicated AI neural processing unit (NPU) with secure tri-radio wireless connectivity. This high degree of integration allows customers to replace up to 60 discrete components with a single package. Pre-certified reference designs eliminate many common integration challenges, reducing the complexity, cost and risk traditionally associated with RF design. Supported by NXP’s software and industry-leading eIQ AI enablement solutions, the i.MX 93W also supports smaller form factors and is designed to accelerate time-to-market for physical AI applications.
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