QuickLogic’s ArcticPro 3 embedded FPGA (eFPGA) IP is now available on Samsung’s 28nm FD–SOI process. This enables OEMs and semiconductor companies to seamlessly integrate the capability of discrete FD-SOI FPGAs into their own ASICs/SoCs to optimiseg system performance, power consumption and cost for edge AI in consumer, IoT and automotive applications.
ICs & Semiconductors
Maxim has healthy regard for reducing development time for wearable devices
Developers can save at least six months of development time using the Health Sensor Platform 3.0 (HSP 3.0), claims Maxim Integrated Products.
MCUs integrate peripherals for sensor-based IoT applications
Sensor-based IoT applications use a combination of analogue functionality and digital control capability to meet cost, size, performance and power parameters for efficiency. In response, Microchip has combined analogue peripherals and multi-voltage operation with inter-peripheral connections in its PIC18-Q41 and AVR DB MCU families. In addition to these attributes for increased system integration and reduced signal acquisition times, they offer the convenience and efficiency of operating in a single design environment, says Microchip.
Bluetooth LE chips enables Wi-Fi 6 to boost IoT performance, says NXP
Claiming to usher in a new phase of connectivity for gaming, audio, industrial and IoT applications, NXP Semiconductors has introduced a family of 2×2 Wi-Fi 6 (802.11ax) Dual Band + Bluetooth/Bluetooth Low Energy (BLE) devices which enable the world’s first Wi-Fi 6 enabled gaming console, says NXP.
About Weartech
This news story is brought to you by weartechdesign.com, the specialist site dedicated to delivering information about what’s new in the wearable electronics industry, with daily news updates, new products and industry news. To stay up-to-date, register to receive our weekly newsletters and keep yourself informed on the latest technology news and new products from around the globe. Simply click this link to register here: weartechdesign.com
