ATP unveils world’s smallest 6.7 mm e.MMC to power next-gen smart wearables
ATP Electronics has become the first e.MMC manufacturer to further shrink the e.MMC size to 6.7 mm. Built on 125-ball Fine Ball Grid Array (FBGA), the new E700Pc / E600Vc solutions shatter dimension constraints, making them the world’s smallest and the first of its kind. As a further miniaturisation of the previous “smallest” package of 7.2 x 7.2 mm introduced in early 2025, the new e.MMC offerings are 67% smaller compared to standard-sized e.MMC while retaining advantages such as power savings and thermal resilience, making them ideal for applications where energy and space are premium considerations.
This achievement was made possible by ATP’s customer-driven innovation, especially with the heightened demand for smart wearables such as smart glasses, which have rigid space limitations on top of low power requirements for extended use.
The unique 125-ball FBGA configuration keeps the 6.7 mm E700Pc / E600Vc e.MMC pin-to-pin compatible with JEDEC specifications, making it compliant with the JEDEC e.MMC 5.1 Standard (JESD84-B51), supporting x1/x4/x8 bus speed modes and featuring High Speed 400 (HS400) DDR Mode for faster programming and improved bandwidths of up to 400 MB/s.
Despite its smaller package, the 6.7 e.MMC is thermally efficient, with ATP tests confirming that heat generation and dissipation are managed well to ensure optimal performance and reliability.
The new form factor also sports a thinner z-height (0.65mm) profile in consideration of smart glasses with slim, rectangular frames so it perfectly blends into the glasses’ technical, ergonomic, and aesthetic features. Additionally, the 6.7 mm e.MMC can be paired with discrete Low-Power Double Data Rate (LPDDR) memory and major system-on-chip (SoC) platforms, providing an ultra-compact and efficient memory solution that supports the smart glasses’ slim design and advanced performance requirements.
ATP’s 6.7 mm e.MMC features power management firmware that is tuned to enable a faster switch from Active to Idle operation. This Auto Power-Saving Mode, together with Power Optimisation technology, allows the device to conserve up to 70% power, thereby extending use, which is a crucial advantage for smart wearables running on batteries.
The 6.7 mm e.MMC is available in native triple level cell (TLC) with 64 GB capacity and 12 TB endurance. For customers who can trade off lower capacities for higher endurance, the E700Pc is configured with pseudo single level cell (pSLC) at 20 GB storage and 680 TB endurance for prolonged usability for write behaviour intense workloads. The capacity range is optimal for mainstream low- and mid-end wearables, with SoCs supporting e.MMC interfaces for flexible integration in various wearable designs.
Advanced error correction ensures the accuracy and reliability of stored information, thus reducing the risk of data corruption. Wear levelling extends the overall lifespan of the e.MMC by distributing writes and erase cycles evenly. Auto Refresh provides data protection against read disturb and other retention issues on areas with read-intensive operations (hot zones), while Dynamic Data Refresh targets rarely accessed areas (cold zones).
The 6.7 mm eMMC is especially suited for uninterrupted use in mobile, outdoor, and demanding scenarios where smart wearables operate. Support for commercial operating temperature range from 25°C up to 85°C offers exceptional temperature tolerance while the soldered-down design ensures vibration-proof reliability and durability amidst constant movement and vigorous shaking.
