Bluetooth Smart SiP simplifies app and sensor development
Based on the Nordic Semiconductor nRF51822 SoC and smaller than the size of an adult thumbnail, the ISP130301 is a drop-in solution that requires nothing more than a 2.1 to 3.6V on-board power source and sensor (if applicable), claims Insight SiP. In addition, says the French SiP (system-in-package) specialist, it can run up to several years from a coin cell (watch) battery
The SiP measures 8 x 11 x 1.2mm, housed in a QFN, LGA package. The Bluetooth Smart module does not require specialist RF engineering experience and targets highly space-constrained smartphone and tablet appcessories, and computer accessories, such as body-worn health and wellness sensors and key fob proximity detectors. The module includes the nRF51822 and it’s 32bit ARM Cortex M0 microprocessor, 256kbyte of flash memory, and full suite of analogue and digital peripherals (including two-wire, ADC, AES, GPIO, PWM, real-time clock, RNG, SPI, temperature sensor, and UART), a DC/DC converter, integrated RF antenna, 16MHz and 32kHz high stability quartz oscillators, plus an RF matching circuit and passive components. FCC and CE EMC certification is pending although the Bluetooth SIG is certified to the latest Bluetooth v4.1 specification, can be configured to operate in slave or master mode. It requires no external supporting components beyond an on-board power source and for sensing applications, an appropriate sensor. Power consumption is also optimized for low power operation with a claimed typical performance of 10.5mA for transmission, 12.6mA for reception, 2.3µA for standby, and 0.5µA for deep sleep mode. The module supports nRF51-compatible reference designs, development tools and software including the nRFgo Evaluation Kit for nRF51822 (nRF51822 EK); nRFgo Development Kit for nRF51822 (nRF51822 DK); ARM mbed Evaluation Kit using nRF51822 SoC (nRF51822-mKIT).
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