xMEMS to showcase µCooling and Sycamore MEMS loudspeaker technologies at CES 2026
xMEMS Labs has announced its participation at CES 2026 (January 6–9, Las Vegas, The Venetian, Suite 34-208), where it will demonstrate category-defining innovations for the fast-accelerating market of AI-enabled wearable and mobile devices.
At the show, xMEMS will highlight two flagship piezoMEMS technologies uniquely suited for the new class of all-day-wearable, AI-powered consumer electronics:
µCooling – the world’s first air-pump-on-a-chip: a 1-mm-thin, solid-state micro-blower capable of delivering local, targeted airflow to manage heat from AI processors in devices too thin for mechanical fans – such as smart glasses, smartphones, SSDs, and other compact edge-AI systems.
Sycamore – the world’s first silicon MEMS loudspeaker: a 1.28-mm-thin, 150 milligram driver delivering full-range, high-fidelity sound in a solid-state form factor up to 90% lighter than traditional speakers. This enables ultra-thin AI glasses, open-fit earbuds, headphones, and other AI voice-enabled devices that are more comfortable to wear and deliver clearer, richer sound.
Consumer electronics are entering a period defined by on-device AI, higher compute density, and shrinking form factors. Traditional moving-coil speakers and mechanical fans are hitting physical limits just as devices require greater acoustic performance and tighter thermal control. xMEMS’ monolithic silicon approach replaces these ageing mechanical systems with solid-state architectures engineered for the AI age.
At The Venetian, xMEMS will demonstrate how its latest MEMS technologies elevate performance, design, and comfort across product categories:
AI Glasses: ultra-thin frames combining rich audio from Sycamore with silent, localised thermal management from µCooling to maintain surface temperatures that remain cool against the skin during on-device AI workloads and extended video recording.
Headphones & Earbuds: full-range Sycamore sound with µCooling-enabled humidity and temperature control for all-day wear.
Smartphones & Tablets: µCooling dissipating heat from AI-class processors inside increasingly compact enclosures.
SSDs & Edge Compute: µCooling stabilising thermals to maintain sustained throughput and zero data throttling in high-density storage and compute devices.
Together, these demonstrations underscore how piezoMEMS is becoming a foundational hardware layer for AI-enabled devices and core building blocks in the broader rise of Physical AI – the convergence of AI compute, user-centric industrial design, and next-generation solid-state components.
