Low dropout regulator is in bumpless CSP for flexible design
For wearable and portable devices and for flexible electronics such as multi-function connected smart cards, the LDBL20 is a 200mA low dropout (LDO) regulator in a 0.47 x 0.47 x 0.2mm chip-scale package (CSP).
The bumpless STStamp package breaks through the minimum I/O area and height limitation imposed by the diameter of traditional flip-chip solder bumps. As a result, it enables unprecedentedly small footprints and low mounted heights.
The 200mA output makes the LDO regulator as powerful as larger devices from other manufacturers, claims the company. The input voltage can range from 1.5 to 5.5V, with 200mV typical dropout. Rejection (PSRR) of 80dB at 100Hz and 50dB at 100kHz simplifies filtering over a wide frequency range to provide a stable rail for low-power circuitry in battery-operated applications. Quiescent current of 20microA no-load, 100microA full-load, and 0.3microA in standby help maximise efficiency under all operating conditions.
A range of output voltages is available on request, from 0.8 up to 5.0V in 50mV increments. Features include logic-controlled electronic shutdown, internal soft-start, and support for active output-voltage discharge if required.
An evaluation board, the STEVAL-ISB034V1, is also available, which assists design-in fitness and blood-pressure monitors, glucose meters, hearing aids, wearable sensors, smart headphones, portable audio devices, smart plugs, smart watches, and smartcards.
http://www.st.com
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